Offers from sellers (3)
Can be delivered from 7 to 14 days
Can be delivered from 6 to 10 days
Gigabyte X870E AORUS PRO X3D ICE
- High‑end ATX motherboard for AMD AM5 (X870E chipset).
- Optimized for Ryzen X3D with X3D Turbo Mode 2.0.
- 4 x DDR5 DIMM (up to 256 GB) and multi‑channel memory tuning.
- 4 x M.2 (2x PCIe 5.0 + 2x PCIe 4.0) and 4 x SATA ports.
- Wi‑Fi 7 (Qualcomm QCNCM865), Bluetooth 5.4 and Realtek 5GbE.
- Dual USB4 Type‑C, USB 3.2 Gen2, and USB3.2 Gen2x2 header.
Description
The GIGABYTE X870E AORUS PRO X3D ICE is a high‑end ATX motherboard for AMD AM5 (Ryzen) platforms with a white "ICE" aesthetic. It supports DDR5 memory up to 256GB, offers four M.2 slots (including PCIe 5.0), dual USB4 Type‑C ports, integrated Wi‑Fi 7 and 5GbE — designed for gaming builds and heavy workloads with enhanced thermal and power delivery features.
- Chipset: AMD X870E.
- Socket: AMD Socket AM5 — supports Ryzen 9000 / 8000 / 7000 series.
- Memory: 4 x DDR5 DIMMs, up to 256 GB; AMD EXPO and XMP compatible.
- Connectivity: Dual USB4 Type‑C, USB 3.2 Gen2/Gen2x2 header, Wi‑Fi 7 and Realtek 5GbE.
| Model | GIGABYTE X870E AORUS PRO X3D ICE |
|---|---|
| Brand | Gigabyte / AORUS |
| Manufacturer | GIGABYTE Technology |
| EAN / UPC | 0889523053164 (UPC: 889523053164) |
| Chipset | AMD X870E |
| Socket | AMD Socket AM5 (supports Ryzen 9000 / 8000 / 7000) |
| Form Factor | ATX — 30.5 cm x 24.4 cm |
| Memory | 4 x DDR5 DIMM, up to 256 GB, AMD EXPO / XMP support (speeds up to 9000(O.C) listed) |
| PCIe / Expansion | 1 x PCIe 5.0 x16 (CPU), 1 x PCIe 4.0 x16 (chipset, x4), 1 x PCIe 3.0 x16 (x2) |
| M.2 Slots | 4 x M.2 (2 x PCIe5.0 from CPU, 2 x PCIe4.0 from chipset) |
| SATA | 4 x SATA 6Gb/s |
| USB | 2 x USB4 Type‑C (rear), 2 x USB 3.2 Gen2 Type‑C, 5 x USB 3.2 Gen2 Type‑A, internal USB3.2 Gen2x2 header |
| LAN | Realtek 5GbE LAN |
| Wireless | Qualcomm Wi‑Fi 7 QCNCM865, Bluetooth 5.4 |
| Audio | Realtek ALC1220, 7.1 HD audio, optical S/PDIF out |
| Power / VRM | 18+2+2 Twin Digital VRM design for stable power delivery. |
| Cooling | M.2 Thermal Guard L, M.2 EZ‑Flex, integrated heatsinks and thermal plates |
| Extras | X3D Turbo Mode 2.0 (AI-enhanced), Q-Flash Plus, PCIe EZ-Latch Plus, EZ-Debug Zone, RGB/ARGB headers |
Source: GIGABYTE official specifications.
Quick verdict: The X870E AORUS PRO X3D ICE is a feature-rich, aesthetically striking white ATX board tailored for X3D Ryzen CPUs. It combines modern I/O (USB4, Wi‑Fi 7, 5GbE), comprehensive M.2 storage options and robust VRM/power delivery for stable performance in gaming and content creation.
Pros: extensive connectivity, four M.2 slots with thermal solutions, and AI-enhanced X3D Turbo Mode 2.0 for improved X3D gaming performance. Cons: premium positioning and the usual BIOS/compatibility attention required with new CPU generations.
Sources: GIGABYTE product and specification pages.
Български
English
Română















